Fabrication Methods

Manufacturing and Integration Strategies for Flexible Electronics Across Form Factors

Wedyan Babatain, Assistant Professor, Electrical and Computer Engineering

Sep 6, 12:00 - 13:00

B9 R2325

advanced manufacturing high-density Circuits circuit design Fabrication Methods fabrication

This talk presents manufacturing and integration strategies for flexible electronics across form factors, from E-LIG, a laser-enabled additive process for functional flexible printed circuit boards, to FiberCircuits, which embed complete circuits within fibers for interactive textiles.

Mario Lanza

Associate Professor, Material Science and Engineering

Fabrication Methods Nanoelectronic Characterization

Professor Lanza’s research focuses on the development novel (beyond CMOS) hardware for the implementation of artificial neural networks. His team fabricate crossbar arrays of memristors that can be used for fast and low-power vector matrix multiplication via Kirchhoff’s law, which provides a very high parallelism and could overcome the limitations of the von Neuman computing architecture. One innovative factor of Professor Lanza’s work is that he uses two-dimensional (2D) materials to construct his crossbar arrays of memristors. Hence, his work also contributes to the introduction of 2D materials in the semiconductors industry, and he is a pioneer on the development of hybrid 2D/CMOS microchips.